Form-In-Place
Form-In-Place in an automated system for dispensing conductive elastomer EMI shielding, grounding and environmental gaskets onto metal or plastic substrates.
Gaskets can be dispensed onto any conductive painted, plated, or metallic surface of an electronics enclosure to protect it against internally and externally radiated interference and environmental elements.
Features and Benefits
- Cost savings in the form of raw materials, labor and assembly time
- Gaskets as small as 0.4mm can be applied on your product allowing more critical packaging space for board level components
- Room temperature cure gasketing materials eliminate the need for costly heat curing systems
- Single-component compounds eliminate ingredient mixing thus shortening production cycles
- High shielding effectiveness of 70 - 100 dB to 18 GHz
- Dispensing system supports high volume production schedules
- Excellent adhesion on a wide variety of metal and plastic substrates
Applications
- Wireless handsets
- PDAs
- PC cards
- Telecommunications base stations
- Satellite radios
- Navigation systems
- Test equipment
Product Specification Overview
