Thermally Conductive Gap Fillers
Laird Technologies’ thermally conductive gap fillers are future generation compliant cooling materials. These thermally conductive gap fillers are the softest and highest thermally conductive gap fillers available (in thicknesses ranging from 0.25 mm to 5.08 mm).
Laird Technologies’ thermally conductive gap fillers deliver engineers and designers the most dimensional tolerance. Extreme compliancy reduces component stress while higher thermal conductivity provides thermal performance required for next generation designs.
Applications:
- Notebook computers
- Handheld microprocessor devices
- Telecommunications hardware
- Semiconductor test equipment
- Servers and desktop computers
- Memory modules
- Mass storage devices
- Power conversion equipment
- Flat panel displays
- Audio and video components
Products
- T-pli™ 200
- T-flex™ 200T VO
- T-flex™ 200 V0
- T-flex™ 300
- T-flex™ 500
- T-flex™ 600
- T-putty™ 502
- T-putty™ 504
Technical Specifications
Click icon to access technical product specifications
Specification Sheets & Brochures
