Tape

Laird Technologies’ tape products offer simple installation and are ideal for thin or low profile applications. Tape provides the flexibility of design for grounding and shielding solutions for I/O shielding panels, disk drive insulators, ground planes or circuit boards, electromedical devices and keyboard devices. Tape comes in a wide variety of materials to meet galvanic compatibility requirements.

All dimensions shown in inches (millimeters) unless otherwise specified
Product Highlights	• Simple installation • Ideally suited for thin or low profile applications • Conductive foil tape with release mask for painted enclosures • Tinned copper cloth and nickel copper cloth versions provide an easy to handle alternative to foils
SHIELDING EFFECTIVENESS Transfer Impedance (500 MHz)	-
H-field (200 KHz) Mil 285	-
Plane Wave (2 GHz) Mil 285	85 - 95 dB
Surface Resistivity	0.032 ohm/cm2 through adhesive
Volume Resistivity	N/A
Available Size Range	0.025 - 2.00 (6,4 - 50,8) Width 0.003 - 0.007 (0,08 - 0,18) Thick
Deflection Operating Range	N/A
Compression Force (based on shape selection)	N/A
Compression Set	N/A
Joint Unevenness Accommodation	N/A
Compound/Material Availability	Tin plated copper, copper foil, nickel copper cloth tape
Temperature Range	50 - 500°F (10 - 260°C) based on material selection
Available Profiles	Rolls
Mounting Methods	Pressure sensitive adhesive, conductive or nonconductive
Custom Shapes Available	Die cut shapes
Fluid Seal	N/A
Air/Dust	N/A
Galvanic Compatibility	Wide variety of materials available to meet galvanic compatibility requirements
Typical Applications for Shielding Gaskets	• Flexibility of design provides grounding and shielding solutions for I/O shielding panels, disk drives insulators, ground planes or circuit boards, electromedical devices, keyboard devices • Mask and peel tape for painted electronic enclosures • Cable and wire harness wrapping